US Patent Issued to Applied Materials on Feb. 24 for "Descending etching resistance in advanced substrate patterning" (South Korean, American, Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,909, issued on Feb. 24, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Descending etching resistance in advanced substrate patterning" was invented by Chung-Chia Chen (San Jose, Calif.), Ji Young Choung (Hwaseong-si, South Korea), Dieter Haas (San Jose, Calif.), Yu-Hsin Lin (Zhubei, Taiwan), Jungmin Lee (Santa Clara, Calif.), Wen-Hao Wu (San Jose, Calif.) and Si Kyoung Kim (Gwangju-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Sub-pixel circuits and methods of forming sub-pixel circuits that may be utilized in a display such as an organic light-emitting diode (OLED) display. In one example, a device includes a substr...