ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,555,748, issued on Feb. 17, was assigned to Applied Materials Inc. (Santa Clara, Calif.).
"Symmetric plasma process chamber" was invented by James D. Carducci (Sunnyvale, Calif.), Hamid Tavassoli (Cupertino, Calif.), Ajit Balakrishna (Santa Clara, Calif.), Zhigang Chen (Campbell, Calif.), Andrew Nguyen (San Jose, Calif.), Douglas A. Buchberger Jr. (Livermore, Calif.), Kartik Ramaswamy (San Jose, Calif.), Shahid Rauf (Pleasanton, Calif.) and Kenneth S. Collins (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present invention provide a plasma chamber design that allows extremely symmetrical electrical, thermal, and gas ...