US Patent Issued to Applied Materials on Feb. 17 for "Method of ultra thinning of wafer" (Singaporean, American, Dutch Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,343, issued on Feb. 17, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Method of ultra thinning of wafer" was invented by Suketu Arun Parikh (San Jose, Calif.), Ashish Pal (San Ramon, Calif.), El Mehdi Bazizi (San Jose, Calif.), Andrew Yeoh (Portland, Ore.), Nitin K. Ingle (San Jose, Calif.), Arvind Sundarrajan (Singapore), Guan Huei See (Singapore), Martinus Maria Berkens (Eindhoven, Netherlands), Sameer A. Deshpande (Santa Clara, Calif.), Balasubramanian Pranatharthiharan (San Jose, Calif.) and Yen-Chu Yang (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a semiconductor device is provided. Th...