US Patent Issued to Applied Materials on Dec. 23 for "Substrate processing module and method of moving a workpiece" (Indian, American Inventors)

ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,020, issued on Dec. 23, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Substrate processing module and method of moving a workpiece" was invented by Kirankumar Neelasandra Savandaiah (Bangalore, India), Srinivasa Rao Yedla (Bangalore, India) and Thomas Brezoczky (Los Gatos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments disclosed herein include a substrate processing module and a method of moving a workpiece. The substrate processing module includes a shutter stack and two process stations. The shutter stack is disposed between the process stations. The method of moving a workpiece includes moving a supporting port...