US Patent Issued to Applied Materials on Aug. 4 for "Process kit alignment method for improving semiconductor yield" (Texas Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,697,719, issued on Aug. 4, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Process kit alignment method for improving semiconductor yield" was invented by Damon K. Cox (Jarrell, Texas), Ali Utku Pehlivan (Austin, Texas) and Paul Benjamin Reuter (Austin, Texas).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method includes causing an upper process kit ring to be removed from a lower process kit ring. The method further includes, responsive to causing the upper process kit ring to be removed from the lower process kit ring, causing, based on sensor data, a first position correction associated with the lower process kit ring. The method furt...