US Patent Issued to Applied Materials on Aug. 4 for "Lithography apparatus, patterning system, and method of patterning a layered structure" (California Inventor)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,699,323, issued on Aug. 4, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Lithography apparatus, patterning system, and method of patterning a layered structure" was invented by Christopher Dennis Bencher (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of the present disclosure include a lithography apparatus, patterning system, and method of patterning a layered structure. The patterning system includes an image formation device and a reactive layer. The patterning system allows for creating lithography patterns in a single operation. The lithography apparatus includes the patterning system and an optical ...