US Patent Issued to Applied Materials on Aug. 18 for "Methods for patterning substrates to adjust voltage properties" (California Inventors)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,851, issued on Aug. 18, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Methods for patterning substrates to adjust voltage properties" was invented by Steven C. H. Hung (Sunnyvale, Calif.), Srinivas Gandikota (Santa Clara, Calif.), Yixiong Yang (San Jose, Calif.) and Yong Yang (Mountain View, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method of forming a structure on a substrate is provided. The method includes depositing a dipole dopant containing (DDC) layer including a dipole dopant on a first and second region of a dielectric layer (DL) of the substrate. A hardmask (HM) is deposited over the DDC deposited on the firs...