US Patent Issued to Applied Materials on Aug. 11 for "Electroplating systems and methods with increased metal ion concentrations" (Montana Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,703,926, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"Electroplating systems and methods with increased metal ion concentrations" was invented by Paul R. McHugh (Kalispell, Mont.), Forrest G. Reinhart (Kalispell, Mont.), Gregory J. Wilson (Kalispell, Mont.), Kwan Wook Roh (Kalispell, Mont.), Kyle M. Hanson (Kalispell, Mont.), James E. Brown (Kalispell, Mont.) and David J. Reis (Kalispell, Mont.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Electroplating methods may include providing an electrolyte feedstock comprising copper to a first compartment of an electrochemical cell. The methods may include providing an aci...