US Patent Issued to APPLIED Materials on April 7 for "Coplanarity improvement of high-rate CU pillar processes using high agitation to enable use of high acid, low CU chemistries" (Montana Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,595,581, issued on April 7, was assigned to APPLIED Materials Inc. (Santa Clara, Calif.).

"Coplanarity improvement of high-rate CU pillar processes using high agitation to enable use of high acid, low CU chemistries" was invented by Paul R. McHugh (Kalispell, Mont.), Gregory J. Wilson (Kalispell, Mont.) and John L. Klocke (Kalispell, Mont.).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electroplating system including a Cu bath disposed within a vessel, the Cu bath characterized by a predetermined threshold of Cu concentration, and a predetermined threshold of acid concentration, and where a substrate is submerged in the Cu bath; and a jet array confi...