US Patent Issued to Applied Materials on April 21 for "High heat loss heater and electrostatic chuck for semiconductor processing" (Indian, American Inventors)

ALEXANDRIA, Va., April 21 -- United States Patent no. 12,606,912, issued on April 21, was assigned to Applied Materials Inc. (Santa Clara, Calif.).

"High heat loss heater and electrostatic chuck for semiconductor processing" was invented by Jian Li (Fremont, Calif.), Juan Carlos Rocha-Alvarez (San Carlos, Calif.), Mayur Govind Kulkarni (Bangalore, India), Paul L. Brillhart (Pleasanton, Calif.), Vidyadharan Srinivasamurthy (Bengaluru, India), Katherine Woo (Santa Clara, Calif.) and Wenhao Zhang (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Exemplary substrate support assemblies may include an electrostatic chuck body defining a support surface that defines a substrate seat. The substrate su...