US Patent Issued to Apple on March 24 for "Die stitching and harvesting of arrayed structures" (California Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,494, issued on March 24, was assigned to Apple Inc. (Cupertino, Calif.).

"Die stitching and harvesting of arrayed structures" was invented by Sanjay Dabral (Cupertino, Calif.), Jun Zhai (Cupertino, Calif.), Kunzhong Hu (Cupertino, Calif.) and Raymundo M. Camenforte (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Multi-die structures with die-to-die routing are described. In an embodiment, each die is patterned into the same semiconductor substrate, and the dies may be interconnected with die-to-die routing during back-end wafer processing. Partial metallic seals may be formed to accommodate the die-to-die routing, programmable dici...