ALEXANDRIA, Va., July 15 -- United States Patent no. 12,663,867, issued on June 23, was assigned to Apple Inc. (Cupertino, Calif.).

"Haptic structure for providing haptic outputs at an electronic device" was invented by Alex J. Lehmann (Sunnyvale, Calif.), Joonas I. Ponkala (San Jose, Calif.), Keith J. Hendren (San Francisco), Xian Wang (San Mateo, Calif.), Yu-Lin Kao (Livermore, Calif.) and Kevin C. Armendariz (San Francisco).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments are directed to an electronic device that includes a cover and a haptic module positioned below the cover. The haptic module includes a substrate positioned below the cover and offset from the cover, a spacer positioned between ...