US Patent Issued to Apple on Dec. 9 for "3D embedded redistribution layers for IC substrate packaging" (Arizona, California Inventors)

ALEXANDRIA, Va., Dec. 9 -- United States Patent no. 12,494,433, issued on Dec. 9, was assigned to Apple Inc. (Cupertino, Calif.).

"3D embedded redistribution layers for IC substrate packaging" was invented by Ryan Mesch (Phoenix) and Jun Chung Hsu (Cupertino, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Improved redistribution layer structures for integrated circuit or system-on-chip (SoC) packages substrate are disclosed. Via landing pads and via interconnects in the redistribution layers are self-aligning with the centers of the vias aligning with the pads. This self-alignment may allow pads that terminate non-stacked vias to have decreased widths or diameters without extra capture space. The redi...