ALEXANDRIA, Va., Dec. 23 -- United States Patent no. 12,506,117, issued on Dec. 23, was assigned to Apple Inc. (Cupertino, Calif.).
"Wafer level integration of passive devices" was invented by Jun Zhai (San Jose, Calif.).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device is described that includes an integrated circuit coupled to a first semiconductor substrate with a first set of passive devices (e.g., inductors) on the first substrate. A second semiconductor substrate with a second set of passive devices (e.g., capacitors) may be coupled to the first substrate. Interconnects in the substrates may allow interconnection between the substrates and the integrated circuit. The passive devices ...