US Patent Issued to APAQ TECHNOLOGY on March 24 for "Capacitor assembly package structure having outermost reinforcement structures" (Taiwanese Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,586,732, issued on March 24, was assigned to APAQ TECHNOLOGY Co. LTD. (Miaoli County, Taiwan).

"Capacitor assembly package structure having outermost reinforcement structures" was invented by Shang-Che Lan (Kaohsiung City, Taiwan), Che-Wei Chang (Miaoli County, Taiwan), Shuo-Yen Ma (Changhua County, Taiwan) and Yuh-Shyuan Lai (Tainan City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A capacitor assembly package structure includes a first bottom electrode structure, a second bottom electrode structure, a capacitor assembly and an insulating package body. The second bottom electrode structure is separate from the first bottom electrode structur...