US Patent Issued to APAQ TECHNOLOGY on Jan. 20 for "Movable device and wound capacitor package structure thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,531,190, issued on Jan. 20, was assigned to APAQ TECHNOLOGY Co. LTD. (Miaoli County, Taiwan).

"Movable device and wound capacitor package structure thereof" was invented by Chung-Jui Su (Kaohsiung, Taiwan) and Ming-Tsung Liang (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A movable device and a wound capacitor package structure thereof are provided. A first gap defined between a first exposed portion of a first conductive pin and an inner surface of a first bottom guide channel of the bottom seat plate ranges from 0.01 mm to 0.2 mm, and a first exposed height defined from a bottom side of the first exposed portion to the bottom side...