US Patent Issued to ANSYS on July 28 for "Multiscale thermal reduced order model for transient IC analysis" (California, Massachusetts, New Hampshire, Pennsylvania Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,694,183, issued on July 28, was assigned to ANSYS INC. (Canonsburg, Pa.).

"Multiscale thermal reduced order model for transient IC analysis" was invented by David Geb (Walnut Creek, Calif.), Saeed Asgari (Westborough, Mass.), Akhilesh Kumar (Milpitas, Calif.), Jimin Wen (Pleasanton, Calif.), Norman Chang (Fremont, Calif.), Hsiming Pan (San Jose, Calif.), Mehdi Abarham (Belmont, Calif.), Haiyang He (Washington, Pa.) and Viralkumar Girishchandra Gandhi (Nashua, N.H.).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one embodiment, several reduced order models (ROMs), each at a different scale, are developed to create a multiscale ROM for a given system, w...