US Patent Issued to Analog Devices International UnLtd. on Jan. 27 for "Integrated circuit packages to minimize stress on a semiconductor die" (Irish Inventors)

ALEXANDRIA, Va., Jan. 28 -- United States Patent no. 12,538,804, issued on Jan. 27, was assigned to Analog Devices International UnLtd. Co. (Limerick, Ireland).

"Integrated circuit packages to minimize stress on a semiconductor die" was invented by Ramji Sitaraman Lakshmanan (Limerick, Ireland), Bernard Stenson (Upper Manister, Ireland), Padraig Liam Fitzgerald (Mallow, Ireland), Oliver Kierse (Killaloe, Ireland), Michael James Twohig (County Cork, Ireland), Michael John Flynn (Waterford, Ireland) and Laurence Brendan O'Sullivan (Limerick, Ireland).

According to the abstract* released by the U.S. Patent & Trademark Office: "An integrated circuit package can contain a semiconductor die and provide electrical connections between the semicon...