US Patent Issued to AMULAIRE THERMAL TECHNOLOGY on June 23 for "Surface-modified aluminum alloy substrate structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,662,739, issued on June 23, was assigned to AMULAIRE THERMAL TECHNOLOGY INC. (New Taipei City, Taiwan).

"Surface-modified aluminum alloy substrate structure" was invented by Yi-Hsin Huang (New Taipei City, Taiwan), Ching-Ming Yang (New Taipei City, Taiwan), Kuo-Wei Lee (New Taipei City, Taiwan) and Tze-Yang Yeh (New Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A surface-modified aluminum alloy substrate structure includes a 6000-Series aluminum alloy substrate, a diffusion buffer layer, and a meltable metallic layer. The diffusion buffer layer is formed on the 6000-Series aluminum alloy substrate for buffering magnesium in the 6000...