ALEXANDRIA, Va., July 21 -- United States Patent no. 12,687,349, issued on July 21, was assigned to AMULAIRE THERMAL TECHNOLOGY INC. (New Taipei City, Taiwan).
"Immersion-type liquid cooling heat dissipation structure" was invented by Kuo-Wei Lee (New Taipei City, Taiwan), Ching-Ming Yang (New Taipei City, Taiwan), Chi-An Chen (New Taipei City, Taiwan) and Tze-Yang Yeh (New Taipei City, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An immersion-type liquid cooling heat dissipation structure is provided. The immersion-type liquid cooling heat dissipation structure includes a metal heat dissipation substrate layer and a metal film layer. The metal film layer is formed on a surface of the metal heat dis...