US Patent Issued to Amkor Technology Singapore Holding on May 13 for "Semiconductor device including heat sink with exposed side from encapsulant and a method of manufacturing thereof" (South Korean Inventors)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,584, issued on May 13, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Semiconductor device including heat sink with exposed side from encapsulant and a method of manufacturing thereof" was invented by Hyung Jun Cho (Incheon, South Korea), Kyoung Yeon Lee (Incheon, South Korea), Tae Yong Lee (Gyeonggi-do, South Korea) and Jae Min Bae (Seoul, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one example, a semiconductor device comprises a substrate having a top surface and a bottom surface, an electronic device on the bottom surface of the substrate, a leadframe on the bottom surface of the substrate, the leadfr...