US Patent Issued to Amkor Technology Singapore Holding on May 13 for "Method of forming a packaged semiconductor device having enhanced wettable flank and structure" (Arizona Inventor)

ALEXANDRIA, Va., June 12 -- United States Patent no. 12,300,582, issued on May 13, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Method of forming a packaged semiconductor device having enhanced wettable flank and structure" was invented by Pedro Joel Rivera-Marty (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A packaged electronic device includes a substrate having a lead. The lead includes an outward facing side surface having a first height, and an inward facing side surface having a second height that is less than the first height. An electronic device is electrically connected to the lead. A package body encapsulates the electronic device and portions of the...