US Patent Issued to Amkor Technology Singapore Holding on Dec. 2 for "Electronic devices having inner electronic component interposed between substrates and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., Dec. 2 -- United States Patent no. 12,489,101, issued on Dec. 2, was assigned to Amkor Technology Singapore Holding Pte. Ltd. (Singapore).

"Electronic devices having inner electronic component interposed between substrates and method of manufacturing the same" was invented by Sang Hyeon Lee (Incheon, South Korea), Kyoung Yeon Lee (Incheon, South Korea), Jae Beom Shim (Incheon, South Korea), Yi Seul Han (Incheon, South Korea), Ji Yeon Ryu (Incheon, South Korea) and Woo Jun Kim (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "In one example, an electronic device includes a first substrate and a second substrate. The first substrate includes a substrate first side, a substra...