US Patent Issued to Amazon Technologies on Jan. 20 for "Tile assignment for matrix multiplication packing" (California, Washington, Vermont, Texas Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,530,178, issued on Jan. 20, was assigned to Amazon Technologies Inc. (Seattle).

"Tile assignment for matrix multiplication packing" was invented by Jiading Gai (Seattle), Tobias Joseph Kastulus Edler von Koch (Austin, Texas), Robert Geva (Cupertino, Calif.), Paul Gilbert Meyer (Jericho, Vt.), Donald John Kretsch (Cupertino, Calif.) and Ron Diamant (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A technique for arranging matrix multiplications for concurrent execution in an integrated circuit device may include obtaining a representation of a data dependency graph of a neural network model. The data dependency graph may include having an...