US Patent Issued to Altera on Nov. 3 for "Grid-based interconnect system for modular integrated circuit systems" (American, Malaysian, Indian Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,864, issued on Nov. 3, was assigned to Altera Corp. (San Jose, Calif.).

"Grid-based interconnect system for modular integrated circuit systems" was invented by Lai Guan Tang (Tanjung Bungah, Malaysia), Ankireddy Nalamalpu (Portland, Ore.), Mahesh K. Kumashikar (Bangalore, India) and Atul Maheshwari (Portland, Ore.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Systems and methods are provided for a modular die-to-die interconnect for integrated circuits in a three-dimensional arrangement. An integrated circuit system may include a first chiplet that includes a grid-based interconnect field and a second chiplet that includes a complementary grid-based...