US Patent Issued to Altera on June 30 for "Package substrate with power delivery network" (Malaysian Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,672,558, issued on June 30, was assigned to Altera Corp. (San Jose, Calif.).

"Package substrate with power delivery network" was invented by Loke Yip Foo (Bayan Lepas, Malaysia), Teong Guan Yew (Batu Maung, Malaysia) and Bok Eng Cheah (Gelugor, Malaysia).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure is directed generally to semiconductor packages, semiconductor package substrates, and methods for making them, which include packages substrates with embedded passive devices positioned between plated through hole vias configured for an improved power delivery network."

The patent was filed on Oct. 18, 2021, under Application No. 17/...