ALEXANDRIA, Va., May 19 -- United States Patent no. 12,629,686, issued on May 19, was assigned to ALPS ALPINE Co. LTD. (Tokyo).
"Flow path plate for thermal cycle and thermal cycle device" was invented by Junko Ito (Miyagi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A flow path plate for thermal cycle includes a plate-shaped member extending in a horizontal direction, a heating flow path extending in a horizontal direction in the plate-shaped member, a cooling flow path extending in a horizontal direction in the plate-shaped member, a connecting flow path connecting the heating flow path and the cooling flow path, a heating-target surface contacted by a first temperature adjuster configured to heat...