US Patent Issued to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL on July 7 for "Semiconductor package having multiple redistribution layers and method of making the same" (California Inventors)

ALEXANDRIA, Va., July 7 -- United States Patent no. 12,677,712, issued on July 7, was assigned to ALPHA AND OMEGA SEMICONDUCTOR INTERNATIONAL LP (Toronto).

"Semiconductor package having multiple redistribution layers and method of making the same" was invented by Zhiqiang Niu (Santa Clara, Calif.), Rhys Philbrick (Los Gatos, Calif.), Long-Ching Wang (Cupertino, Calif.), Chunya Wen (Santa Clara, Calif.) and Yan Xun Xue (Los Gatos, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package comprises two or more chips, a first molding layer, a second molding layer, a third molding layer, a fourth molding layer, a bottom redistribution layer (RDL), a middle RDL, and a top RDL. The two or more ...