US Patent Issued to Allegro MicroSystems on Feb. 17 for "High voltage integrated circuit packages with diagonalized lead configuration and method of making the same" (New Hampshire, Massachusetts Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,668, issued on Feb. 17, was assigned to Allegro MicroSystems LLC (Manchester, N.H.).

"High voltage integrated circuit packages with diagonalized lead configuration and method of making the same" was invented by Maurizio Salato (Bedford, Mass.) and William P. Taylor (Amherst, N.H.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Aspects of the present disclosure include systems, structures, circuits, and methods providing integrated circuit (IC) packages or modules having diagonalized leads. First and second semiconductor dies are disposed on a substrate. First and second coils are configured on the substrate for a transformer. The transformer may incl...