US Patent Issued to All Sensors on Sept. 23 for "Sensor package having a channel integrated within a substrate" (California Inventors)

ALEXANDRIA, Va., Sept. 23 -- United States Patent no. 12,422,325, issued on Sept. 23, was assigned to All Sensors Corp. (Morgan Hill, Calif.).

"Sensor package having a channel integrated within a substrate" was invented by Duy Trung Do (San Jose, Calif.), Derek Dean Bowers (Morgan Hill, Calif.) and Dale Allan Dauenhauer (San Jose, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A sensor package includes a substrate and a channel within the substrate. The channel is configured to allow flow of a fluid therethrough. The sensor package also includes a sensor disposed on the substrate and a lid. The sensor is configured to sense a property of the fluid. The lid forms at least one cavity between the lid and...