ALEXANDRIA, Va., Oct. 6 -- United States Patent no. 12,753,531, issued on Oct. 6, was assigned to airweave inc. (Aichi, Japan).
"Device for manufacturing filament three-dimensional bonded member" was invented by Motokuni Takaoka (Aichi, Japan).
According to the abstract* released by the U.S. Patent & Trademark Office: "In a device for manufacturing a filament three-dimensional bonded member that includes: a molten filament supply unit that discharges a molten filament group downward; a chute that includes a chute inclined plate which receives a molten filament at an end in thickness direction of the group and displaces the group in such a direction as to reduce thickness of the group; a cooling water supply unit that supplies cooling wate...