US Patent Issued to AGC on Feb. 24 for "Laminated body, laminated body with member for electronic device, and method for producing electronic device" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,558,876, issued on Feb. 24, was assigned to AGC Inc. (Tokyo).

"Laminated body, laminated body with member for electronic device, and method for producing electronic device" was invented by Hideaki Miyazawa (Tokyo) and Kazuo Yamada (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "A laminated body includes: a supporting base material; an adhesive layer; a metal layer; and a substrate in this order. The metal layer contains at least one metal selected from the group consisting of copper, titanium, palladium, gold, nickel, tungsten, and molybdenum. The metal layer preferably contains at least one metal selected from the group consisting of copper, tita...