US Patent Issued to ADVANTEST on Sept. 1 for "Test method, manufacturing method, panel level package, and test apparatus" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 1 -- United States Patent no. 12,727,435, issued on Sept. 1, was assigned to ADVANTEST Corp. (Tokyo).

"Test method, manufacturing method, panel level package, and test apparatus" was invented by Takeo Miura (Saitama, Japan) and Yasuaki Homma (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a test method including: placing, on a placement unit, a panel level package in which a plurality of unsingulated devices are formed in a matrix; bringing a plurality of contacts electrically connected to a plurality of terminals of a test circuit into contact with a plurality of contact terminals provided on one side in the panel level package in a row direction of the mat...