US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Oct. 14 for "Semiconductor package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,444,689, issued on Oct. 14, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor package and method of manufacturing the same" was invented by Sheng-Ming Wang (Kaohsiung, Taiwan), Tien-Szu Chen (Kaohsiung, Taiwan), Wen-Chih Shen (Kaohsiung, Taiwan), Hsing-Wen Lee (Kaohsiung, Taiwan) and Hsiang-Ming Feng (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor substrate, including a first dielectric layer with a first surface and a second surface, a first conductive via extending between the first surface and the second surface, a first patterned conductive la...