US Patent Issued to Advanced Semiconductor Engineering on Nov. 3 for "Package device" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,782,658, issued on Nov. 3, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Package device" was invented by Jung Jui Kang (Kaohsiung, Taiwan), Shih-Yuan Sun (Kaohsiung, Taiwan), Chiu-Wen Lee (Kaohsiung, Taiwan), Chang Chi Lee (Kaohsiung, Taiwan), Chun-Yen Ting (Kaohsiung, Taiwan) and Hung-Chun Kuo (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package device is provided. The package device includes a first die and a first through via structure. The first die has a first optical I/O. The first through via structure is over the first die. A first region of the first through via structure is configured to di...