US Patent Issued to Advanced Semiconductor Engineering on May 26 for "Semiconductor package including antenna substrate and manufacturing method thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., May 26 -- United States Patent no. 12,640,460, issued on May 26, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Semiconductor package including antenna substrate and manufacturing method thereof" was invented by Han-Chee Yen (Taipei City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes: (1) a package substrate including an upper surface; (2) a semiconductor device disposed adjacent to the upper surface of the package substrate, the semiconductor device including an inactive surface; and (3) an antenna substrate disposed on the inactive surface of the semiconductor device."

The patent was filed on May 30, 2023, under Appli...