US Patent Issued to Advanced Semiconductor Engineering on May 12 for "Semiconductor device package and a method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,625,247, issued on May 12, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Semiconductor device package and a method of manufacturing the same" was invented by Yuanhao Yu (Kaohsiung, Taiwan), Chung Ju Yu (Kaohsiung, Taiwan), Wei-Fan Wu (Kaohsiung, Taiwan), Chai-Chi Lin (Kaohsiung, Taiwan) and Hong Jie Chen (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "At least some embodiments of the present disclosure relate to a wearable device. The wearable device comprises a substrate, a detecting module disposed on the substrate, and a control module disposed on the substrate. The control module is electrically conne...