ALEXANDRIA, Va., March 31 -- United States Patent no. 12,593,740, issued on March 31, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).
"Package structure" was invented by An-Hsuan Hsu (Kaohsiung, Taiwan), Cheng-Yuan Kung (Kaohsiung, Taiwan) and Yaohsin Chou (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes a substrate, a wiring structure, and a wire bundle structure. The wiring structure is over the substrate. The wire bundle structure is between the wiring structure and the substrate. The wire bundle structure includes a first wire bundle extending from the substrate and a second wire bundle extending...