US Patent Issued to Advanced Semiconductor Engineering on March 17 for "Package structure and method for manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., March 17 -- United States Patent no. 12,581,952, issued on March 17, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Package structure and method for manufacturing the same" was invented by Po-Hsien Ke (Kaohsiung, Taiwan), Teck-Chong Lee (Kaohsiung, Taiwan) and Chih-Pin Hung (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a manufacturing method are provided. The package structure includes a wiring structure, a first electronic device, a second electronic device, a first underfill, a second underfill and a stiff bonding material. The first electronic device and the second electronic device are disposed on the wiring struc...