US Patent Issued to Advanced Semiconductor Engineering on July 28 for "Semiconductor device package and acoustic device including the same" (Taiwanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,026, issued on July 28, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Semiconductor device package and acoustic device including the same" was invented by Ming-Tau Huang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A wireless earphone comprises a battery, a speaker and a chamber/space. The battery has a first surface, a second surface opposite the first surface, and a third surface extended between the first surface and the second surface. The battery is disconnected from any protecting circuits. The speaker is disposed adjacent to the first surface of the battery. The chamber/space is defined by ...