US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on July 15 for "Semiconductor device package and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,364,008, issued on July 15, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor device package and method of manufacturing the same" was invented by Ming-Hung Chen (Kaohsiung, Taiwan), Yung I Yeh (Kaohsiung, Taiwan), Chang-Lin Yeh (Kaohsiung, Taiwan) and Sheng-Yu Chen (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device package includes a main substrate, at least one thin film transistor (TFT) module, at least one first electronic component, at least one encapsulant and a plurality of light emitting devices. The main substrate has a first surface and a second surface opposite to...