US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Jan. 20 for "Electronic device and package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., Jan. 20 -- United States Patent no. 12,532,408, issued on Jan. 20, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Electronic device and package structure" was invented by Chien Lin Chang Chien (Kaohsiung, Taiwan), Yuan-Chun Tai (Kaohsiung, Taiwan), Yu Hsin Chang Chien (Kaohsiung, Taiwan), Chiu-Wen Lee (Kaohsiung, Taiwan) and Chang Chi Lee (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device is provided. The electronic device includes a first dielectric layer, an electronic element, an encapsulant, and a second dielectric layer. The first dielectric layer has a first coefficient of thermal expansion (CTE). The electronic element...