US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Feb. 24 for "Semiconductor device package" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,454, issued on Feb. 24, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Semiconductor device package" was invented by Cheng-Yu Ho (Kaohsiung, Taiwan) and Meng-Wei Hsieh (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "The present disclosure provides a semiconductor device package. The semiconductor device package includes a first antenna pattern disposed at a first elevation and a second antenna pattern disposed at a second elevation different from the first elevation. The first antenna pattern and the second antenna pattern define an air cavity. The semiconductor device package also includes a circuit ...