ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,564,078, issued on Feb. 24, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).
"Electronic package" was invented by Pao-Nan Lee (Kaohsiung, Taiwan), Chen-Chao Wang (Kaohsiung, Taiwan) and Chang Chi Lee (Kaohsiung, Taiwan).
According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic package is disclosed. The electronic package includes an electronic component and a plurality of power regulating components. The plurality of power regulating components includes a first power regulating component and a second power regulating component. A first power path is established from the first power regulating component to a backside surface...