US Patent Issued to ADVANCED SEMICONDUCTOR ENGINEERING on Feb. 17 for "Package structure with interposer encapsulated by an encapsulant" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,630, issued on Feb. 17, was assigned to ADVANCED SEMICONDUCTOR ENGINEERING INC. (Kaohsiung, Taiwan).

"Package structure with interposer encapsulated by an encapsulant" was invented by Yung-Shun Chang (Kaohsiung, Taiwan), Sheng-Wen Yang (Kaohsiung, Taiwan), Teck-Chong Lee (Kaohsiung, Taiwan) and Yen-Liang Huang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure is provided. The package structure includes an encapsulant and an interposer. The encapsulant has a top surface and a bottom surface opposite to the top surface. The interposer is encapsulated by the encapsulant. The interposer includes a main body, an interc...