US Patent Issued to Advanced Semiconductor Engineering on April 7 for "Package structure and method of manufacturing the same" (Taiwanese Inventors)

ALEXANDRIA, Va., April 7 -- United States Patent no. 12,597,531, issued on April 7, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Package structure and method of manufacturing the same" was invented by Wu Chou Hsu (Kaohsiung, Taiwan), Hung Yi Chuang (Kaohsiung, Taiwan) and Shin-Luh Tarng (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A package structure and a method of manufacturing the same are provided. The package structure includes an electronic component and a first connection element. The electronic component includes a conductive wire and a magnetic layer encapsulating the conductive wire. The first connection element is electrically connected to the ...