US Patent Issued to Advanced Semiconductor Engineering on April 14 for "Electronic package having humidity indicator" (Taiwanese Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,601,689, issued on April 14, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan).

"Electronic package having humidity indicator" was invented by Shu Ting Mai (Kaohsiung, Taiwan) and Tzu Hsing Chiang (Kaohsiung, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "An electronic device is disclosed. The electronic device includes a carrier, an optical component disposed on the carrier and a humidity indicator within the electronic package. A position of the humidity indicator within the electronic package is arranged such that at least a part of the humidity indicator is visible from a viewpoint outside of the electronic package....