US Patent Issued to ADVANCED MICRO DEVICES on March 24 for "Connecting semicondcutor device assembly components using interconnect dies with spacer component coupled to a portion of an interconnect die" (California, Washington, Texas Inventors)

ALEXANDRIA, Va., March 24 -- United States Patent no. 12,588,486, issued on March 24, was assigned to ADVANCED MICRO DEVICES INC. (Santa Clara, Calif.).

"Connecting semicondcutor device assembly components using interconnect dies with spacer component coupled to a portion of an interconnect die" was invented by Gabriel H. Loh (Bellevue, Wash.), Raja Swaminathan (Austin, Texas) and Rahul Agarwal (Livermore, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package assembly includes a die having a front surface and a back surface opposite to and parallel to the front surface. A first portion of a front surface of an interconnect die is coupled to a portion of the back surface of the die. Th...