US Patent Issued to Advanced Micro Devices on June 16 for "Semiconductor devices including metal wire pairs" (Colorado, North Carolina Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,613, issued on June 16, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).

"Semiconductor devices including metal wire pairs" was invented by Douglas Stirrett (R. Collins, Colo.), Thomas Michael Daum (Granite Falls, N.C.) and Jeffrey Lucas (R. Collins, Colo.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device includes a first metal layer including a plurality of first ground wire pairs alternating with a plurality of first power wire pairs and a second metal layer including a plurality of second ground wire pairs alternating with a plurality of second power wire pairs. A metal-insulator-metal capacitor (MIMCAP) is b...