US Patent Issued to Advanced Micro Devices on Feb. 17 for "Package assembly with thermal interface material gutter" (California Inventors)

ALEXANDRIA, Va., Feb. 17 -- United States Patent no. 12,557,653, issued on Feb. 17, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.).

"Package assembly with thermal interface material gutter" was invented by Michael Flynn (Santa Clara, Calif.) and Otto Joe (Santa Clara, Calif.).

According to the abstract* released by the U.S. Patent & Trademark Office: "A method and apparatus are provided which manages the movement of thermal interface material (TIM) squeezed out from between a lid and an IC die of an IC (chip) package. In one embodiment, a chip package is provided that includes an IC die mounted on a substrate and covered by a lid. A bottom surface of the lid has a die overlapped region facing a top surface of the IC die...